Super Microleaf – 5802 Series

The 5802 Series are 0.4mm pitch, low profile, space-saving Board to Board Connectors that meet needs for downsized and thinner mobile phones, PHSs, digital AV equipment, etc. These products feature a stacking height of 0.8mm and a width of 3.2mm including leads. Despite its thin and low profile, there is little dead space as metal is not exposed on the back of the connector. Thus, it is possible to form wiring patterns on the substrate area which is positioned between the terminals, realizing a suitable structure for high-density packaging. In order to obtain high contact reliability, a pinching structure, which is highly resistant to vibrations and drop shocks, has been adopted for the contact structure. In addition, an original structure in the contact points eliminates foreign matters such as scattered flux. An original locking structure is adopted for the mating structure, which generates a firm “click” sound and enhances the retention force. Connectors with metal tabs and without boss are available as the standard type, but we also plan to offer other variations.