Super Microleaf – 5804 Series

The 5804 Series are 0.4mm pitch, ultra low profile Board to Board Connectors featuring a stacking height of 0.9mm. These products were developed to meet market needs for miniaturization of mobile phones, digital AV equipment, etc. Space saving is greatly achieved with a width of 2.4mm. There is little dead space as metal is not exposed on the back of the connector. Thus, it is possible to form wiring patterns on the substrate area which is positioned between the terminals, realizing a suitable structure for high-density packaging. A pinching structure (two-point contact design) has been adopted to enhance resistance to vibrations or drop shocks . The Twin-rib structure of the contact on the plug side eliminates foreign matters such as scattered flux and chips from board separation and ensures high contact reliability. An original locking structure is adopted for the mating lock structure, which generates a firm “click” sound and enhances the retention force when connectors are removed despite the low profile.