Super Microleaf – 5857 Series


5857_3
Kyocera Connector Products ©
Features & Benefits
  • High robustness and structure for smooth mating with top face covered by metals
  • Space-saving connector with a fine pitch of 0.35mm, stacking height of 0.7mm, and width of 1.9mm
  • Anchoring metal tabs are available for power connection with a rated current of 3.0A(/metal tab)
  • A pinching structure (two-point contact design), which is highly resistant to vibration and drop shocks, has been adopted for the contact structure. Furthermore, the plug contacts have an original structure featuring a wiping effect which eliminates foreign matter with concentrated load, thus realizing high contact reliability
  • Packaged in tape and reel: 15,000 pieces/reel
  • RoHS compliant and Halogen-free
  • Contact Material: Copper alloy
  • Insulator Material: Heat-resistant plastic
  • Operating Temperature Range: -55 to +85°C
Typical Applications
  • Smartphone
  • Tablet PC

The 5857 Series are Board to Board Connectors with a fine pitch of 0.35mm. These products feature a low stacking height of 0.7mm and a space-saving design with a width of 1.9mm. With the fine-pitch and low-profile features, the connector achieves high robustness by covering both ends with metals, which prevents the connector from damage caused by misalignments. The new product has a unique contact structure like the KCP’s existing products, attaining high contact reliability against vibrations or drops.

Datasheet / Catalog – Click to Download
Part Number Information

Part Number Information

5857 Series
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Technical Information – Click to Download