Features & Benefits
- Nickel-plated area on the contact prevents solder wicking
- Contact Material: Copper alloy
- Insulator Material: Heat-resistant plastic
- Operating Temperature Range: -55 to +85°C
Typical Applications
- Small mobile devices
The 8041 Series are super small and low-profile wire to board type connectors featuring a pitch of 0.9mm and mating height of 0.9mm which is one of the lowest in the industry (based on research by Kyocera Connector Products Corporation; as of May 2011). These products were developed to meet market requirements for high- density packaging, especially designed for small mobile devices. The 8041 Series has a pinching structure (two-point contact design) is adopted to enhance resistance to vibrations or drop shocks and ensure high contact reliability. AWG 32, a wire of the standard type, is applicable. A four-point insulator locking structure is adopted to ensure tolerance to impacts and vibrations, which enables a firm “click” feeling and assured retention force in mating despite its low profile.
