Features & Benefits
- HFSS Design Unique for Every Device
- Gold Wire Bondable
- Copper Conductor Design for Improved Circuit Conductivity
- Designs Optimized for RF/Performance
- RoHS Compliant
Typical Applications
- DC Blocking at UHF
- High Frequency Link
- RF/Microwave Applications
This MIM Cap using a transmission line wire bond pad structure with backside ground is designed to provide a unique RF/Microwave solution not available from a traditional SLC. This MIM Cap can be supplied on various substrates to minimize losses. Copper traces are used for optimal conductivity. Front and backside gold metallization make this device suitable for epoxy, gold wire bond/ribbon bond attachment techniques.
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