Hermetically sealed on one end, this style offers both C & L circuit configurations with effective filtering in the HF through microwave frequency spectrum, filtering anywhere between 500 KHz to 26 GHz, depending on size and circuit. High purity gold plating provides excellent solderability or compatibility with thermal and ultrasonic wire bonding. Unique construction on some sizes provides 300°C installation protection against internal solder reflow. Larger diameters facilitate the availability of higher cap values.
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